The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits.
The similarity is such that a PGA socket may be physically compatible with some DIP devices, though the converse is rarely true. ==See also== Chip carrier DIP switch Flatpack (electronics) List of integrated circuit package dimensions NORBIT 2 (a larger 19-pin DIP, introduced in 1967) Pin grid array QFP Surface-mount_technology Zig-zag in-line package == References == ==Further reading== ==External links== DIP packages documentation, photos and videos Chip carriers CPU sockets
DIP chips are still popular for circuit prototyping on a breadboard because of how easily they can be inserted and utilized there. DIPs were the mainstream of the microelectronics industry in the 1970s and 1980s.
This may seem odd today, given the far closer solder pad spacing in use now, but in the 1970s, the heyday of the QIL, bridging of neighbouring solder pads on DIL chips was an issue at times, QIL also increased the possibility of running a copper track between 2 solder pads.
Windowed CERDIP-packaged EPROMs were used for the BIOS ROM of many early IBM PC clones with an adhesive label covering the window to prevent inadvertent erasure through exposure to ambient light. Molded plastic DIPs are much lower in cost than ceramic packages; one 1979 study showed that a plastic 14 pin DIP cost around US$0.063 and a ceramic package cost US$0.82. ===Single in-line=== A single in-line (pin) package (SIP or SIPP) has one row of connecting pins.
This was very handy on the then standard single sided single layer PCBs. Some QIL packaged ICs had added [tabs, such as the HA1306. Intel and 3M developed the ceramic leadless quad in-line package (QUIP), introduced in 1979, to boost microprocessor density and economy.
DIP chips are still popular for circuit prototyping on a breadboard because of how easily they can be inserted and utilized there. DIPs were the mainstream of the microelectronics industry in the 1970s and 1980s.
This is one of the reasons that four-sided and multiple rowed packages, such as PGAs, were introduced (around the early 1980s). A large DIP package (such as the DIP64 used for the Motorola 68000 CPU) has long leads inside the package between pins and the die, making such a package unsuitable for high speed devices. Some other types of DIP devices are built very differently.
Their use has declined in the first decade of the 21st century due to the emerging new surface-mount technology (SMT) packages such as plastic leaded chip carrier (PLCC) and small-outline integrated circuit (SOIC), though DIPs continued in extensive use through the 1990s, and still continue to be used substantially as the year 2011 passes.
PGAs with the same pin centers as most DIPs were popular for microprocessors from the early to mid-1980s through the 1990s.
Since about 2000, newer devices are often unavailable in the DIP format. ===Mounting=== DIPs can be mounted either by through-hole soldering or in sockets.
Their use has declined in the first decade of the 21st century due to the emerging new surface-mount technology (SMT) packages such as plastic leaded chip carrier (PLCC) and small-outline integrated circuit (SOIC), though DIPs continued in extensive use through the 1990s, and still continue to be used substantially as the year 2011 passes.
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