MOSFET

1926

The MOS capacitor is also part of the MOSFET structure. == Early history == === Background === The basic principle of the field-effect transistor (FET) was first proposed by Austrian physicist Julius Edgar Lilienfeld in 1926, when he filed the first patent for an insulated-gate field-effect transistor.

1930

The FET concept was later also theorized by German engineer Oskar Heil in the 1930s and American physicist William Shockley in the 1940s.

1940

The FET concept was later also theorized by German engineer Oskar Heil in the 1930s and American physicist William Shockley in the 1940s.

1950

In the 1950s, researchers had largely given up on the FET concept, and instead focused on BJT technology. In 1955, Carl Frosch and Lincoln Derrick accidentally covered the surface of a silicon wafer with a layer of silicon dioxide.

Atalla at Bell Labs was dealing with the problem of surface states in the late 1950s.

1955

In the 1950s, researchers had largely given up on the FET concept, and instead focused on BJT technology. In 1955, Carl Frosch and Lincoln Derrick accidentally covered the surface of a silicon wafer with a layer of silicon dioxide.

1956

At Shockley Semiconductor, Shockley had circulated the preprint of their article in December 1956 to all his senior staff, including Jean Hoerni. === Invention === Mohamed M.

1957

In 1957, they published a research paper and patented their technique summarizing their work.

Results of their work circulated around Bell Labs in the form of BTL memos before being published in 1957.

He wrote his findings in his BTL memos in 1957, before presenting his work at an Electrochemical Society meeting in 1958.

1958

He wrote his findings in his BTL memos in 1957, before presenting his work at an Electrochemical Society meeting in 1958.

1959

Atalla and Dawon Kahng at Bell Labs in 1959, and first presented in 1960.

Spitzer, who studied the mechanism of thermally grown oxides, managed to fabricate a high quality Si/SiO2 stack, with Atalla and Kahng making use of their findings. The MOSFET was invented when Mohamed Atalla and Dawon Kahng successfully fabricated the first working MOSFET device in November 1959.

1960

Atalla and Dawon Kahng at Bell Labs in 1959, and first presented in 1960.

It is the basic building block of modern electronics, and the most frequently manufactured device in history, with an estimated total of 13sextillion () MOSFETs manufactured between 1960 and 2018.

MOSFET scaling and miniaturization has been driving the rapid exponential growth of electronic semiconductor technology since the 1960s, and enables high-density ICs such as memory chips and microprocessors.

The device is covered by two patents, each filed separately by Atalla and Kahng in March 1960.

They published their results in June 1960, at the Solid-State Device Conference held at Carnegie Mellon University.

The MOSFET was also initially slower and less reliable than the BJT. In the early 1960s, MOS technology research programs were established by Fairchild Semiconductor, RCA Laboratories, General Microelectronics (led by former Fairchild engineer Frank Wanlass) and IBM.

Between 1960 and 2018, an estimated total of 13sextillion MOS transistors have been manufactured, accounting for at least 99.9% of all transistors.

However, unlike CMOS logic (neglecting leakage current), NMOS logic consumes power even when no switching is taking place. Mohamed Atalla and Dawon Kahng originally demonstrated both pMOS and nMOS devices with 20 µm and then 10 µm gate lengths in 1960.

1962

Weimer at RCA in 1962, building on the earlier work of Atalla and Kahng on MOSFETs. The idea of a TFT-based liquid-crystal display (LCD) was conceived by Bernard Lechner of RCA Laboratories in 1968.

1963

CMOS was developed by Chih-Tang Sah and Frank Wanlass at Fairchild in 1963.

The first CMOS integrated circuit was later built in 1968 by Albert Medwin. The first formal public announcement of the MOSFET's existence as a potential technology was made in 1963.

This arrangement greatly reduces power consumption and heat generation. CMOS was developed by Chih-Tang Sah and Frank Wanlass at Fairchild Semiconductor in 1963.

1964

It was then first commercialized by General Microelectronics in May 1964, followed Fairchild in October 1964.

1967

The first report of a floating-gate MOSFET (FGMOS) was made by Dawon Kahng (co-inventor of the original MOSFET) and Simon Min Sze in 1967. The FGMOS is commonly used as a floating-gate memory cell, the digital storage element in EPROM, EEPROM and flash memories.

1968

The first CMOS integrated circuit was later built in 1968 by Albert Medwin. The first formal public announcement of the MOSFET's existence as a potential technology was made in 1963.

Weimer at RCA in 1962, building on the earlier work of Atalla and Kahng on MOSFETs. The idea of a TFT-based liquid-crystal display (LCD) was conceived by Bernard Lechner of RCA Laboratories in 1968.

1970

NMOS was initially faster than CMOS, thus NMOS was more widely used for computers in the 1970s.

CMOS had lower power consumption, but was initially slower than NMOS, which was more widely used for computers in the 1970s.

By the 1970s1980s, CMOS logic consumed over times less power than NMOS logic, and about 100,000 times less power than bipolar transistor-transistor logic (TTL). === Depletion-mode === There are depletion-mode MOSFET devices, which are less commonly used than the standard enhancement-mode devices already described.

Vertical MOSFETs are designed for switching applications. The power MOSFET, which is commonly used in power electronics, was developed in the early 1970s.

The earliest MOSFET sensors include the open-gate FET (OGFET) introduced by Johannessen in 1970, the ion-sensitive field-effect transistor (ISFET) invented by Piet Bergveld in 1970, the adsorption FET (ADFET) patented by P.F.

1974

Cox in 1974, and a [MOSFET demonstrated by I.

1978

In 1978, Hitachi introduced the twin-well CMOS process, which allowed CMOS to match the performance of NMOS with less power consumption.

1980

The twin-well CMOS process eventually overtook NMOS as the most common semiconductor manufacturing process for computers in the 1980s.

1990

MOSFETs thus have much smaller size than BJTs, about one-twentieth of the size by the early 1990s.

2009

The MOSFET is also included on the list of IEEE milestones in electronics, and its inventors Mohamed Atalla and Dawon Kahng entered the National Inventors Hall of Fame in 2009. == Composition == Usually the semiconductor of choice is silicon.

Intel, 2009). The gate is separated from the channel by a thin insulating layer, traditionally of silicon dioxide and later of silicon oxynitride.

2015

The MOSFET generates annual sales of as of 2015.

2018

It is the basic building block of modern electronics, and the most frequently manufactured device in history, with an estimated total of 13sextillion () MOSFETs manufactured between 1960 and 2018.

Between 1960 and 2018, an estimated total of 13sextillion MOS transistors have been manufactured, accounting for at least 99.9% of all transistors.

In a 2018 note on Jack Kilby's Nobel Prize for Physics for his part in the invention of the integrated circuit, the Royal Swedish Academy of Sciences specifically mentioned the MOSFET and the microprocessor as other important inventions in the evolution of microelectronics.




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